Udemy - Advanced Materials For Electronics Packaging

  • CategoryOther
  • TypeTutorials
  • LanguageEnglish
  • Total size406.9 MB
  • Uploaded Byfreecoursewb
  • Downloads46
  • Last checkedDec. 07th '21
  • Date uploadedDec. 04th '21
  • Seeders 0
  • Leechers8

Infohash : 4A9E8828475FDB7957562F59675E57A7B66C100E

Advanced Materials For Electronics Packaging



https://TutGee.com

MP4 | Video: h264, 1280x720 | Audio: AAC, 44.1 KHz, 2 Ch
Genre: eLearning | Language: English + srt | Duration: 31 lectures (55m) | Size: 308.7 MB
Become Expert In The Field Of "Advanced Electronics Material"
What you'll learn:
Need for electronics packaging
Different ICs packaging configurations
3 Packaging variations
Difference between various "FR" boards
Various Substrate materials
Materials used to form "Electronics Glass" & application of "Electronics Glass"
Various Ceramic Substrate materials that are currently being used and its technical details
Advanced "TIM" material : "GELVET"
Various metal matrix composites (MMCS) : Al-Diamond / AlSi / ASiC / Cu-Diamond / Al-Graphite
Role of Diamond
Carbon nanotubes (CNT) & its types : SWCNT / MWCNT
Applications of "CNTS"
Advanced materials used to form "PCM" - Phase Change Materials
Materials used for EMI (Electro-Magnetic Interference) shielding

Requirements
No prior skills required

Description
In this world of fast growing electronics technology & miniaturization process, thousands of new portable and light weight electronics products are launched in the market each day and in various fields of electronics such as - consumer electronics , medical electronics , communication electronics , defence electronics , industrial electronics and in aerospace electronics . Due to complex circuit design & miniaturization , excessive amount of heat dissipation is happening in electronics products which is reducing the life-span of the components/devices .Thus thermal management of all electronics products has become an important issue . In this role of thermal management, "electronics packaging" plays a very important part .

Here in this short course you will study in detail about the "advanced materials used in electronics packaging".

Files:

[ TutGee.com ] Udemy - Advanced Materials For Electronics Packaging
  • Get Bonus Downloads Here.url (0.2 KB)
    • ~Get Your Files Here ! 1. INTRODUCTIONOVERVIEW
    • 1. SELF INTRODUCTION.mp4 (6.1 MB)
    • 1. SELF INTRODUCTION.srt (0.6 KB)
    • 2. OVERVIEW OF COURSE CONTENTS.mp4 (7.3 MB)
    • 2. OVERVIEW OF COURSE CONTENTS.srt (1.4 KB)
    • 3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.mp4 (20.9 MB)
    • 3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.srt (2.7 KB)
    • 4. WHY DO WE NEED DEVICE PACKAGING COATING .mp4 (12.6 MB)
    • 4. WHY DO WE NEED DEVICE PACKAGING COATING .srt (1.3 KB)
    • 5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.mp4 (10.5 MB)
    • 5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.srt (1.3 KB)
    • 6. HIERARCHY OF ELECTRONICS PACKAGING.mp4 (19.2 MB)
    • 6. HIERARCHY OF ELECTRONICS PACKAGING.srt (1.9 KB)
    • 7. 3 PACKAGING VARIATIONS CARD DCAM MCML.mp4 (11.4 MB)
    • 7. 3 PACKAGING VARIATIONS CARD DCAM MCML.srt (1.3 KB)
    • 8. CONCEPT OF CHIP FIRST & CHIP LAST.mp4 (8.9 MB)
    • 8. CONCEPT OF CHIP FIRST & CHIP LAST.srt (0.7 KB)
    2. PACKAGING CONFIGURATIONS
    • 1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.mp4 (6.4 MB)
    • 1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.srt (3.1 KB)
    • 2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.mp4 (14.3 MB)
    • 2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.srt (1.7 KB)
    3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT
    • 1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.mp4 (37.4 MB)
    • 1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.srt (4.2 KB)
    • 2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.mp4 (19.3 MB)
    • 2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.srt (2.4 KB)
    • 3. ELECTRONIC GLASS.mp4 (21.3 MB)
    • 3. ELECTRONIC GLASS.srt (2.9 KB)
    4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS
    • 1. INTRODUCTION TO PCB.mp4 (9.3 MB)
    • 1. INTRODUCTION TO PCB.srt (1.0 KB)
    • 2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.mp4 (19.9 MB)
    • 2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.srt (2.4 KB)
    • 3. FR4 PCB BOARD.mp4 (5.6 MB)
    • 3. FR4 PCB BOARD.srt (1.9 KB)
    5. ADVANCED MATERIAL FOR TIM
    • 1. USE OF GELVET OVER CONVENTIONAL TIMs.mp4 (17.1 MB)
    • 1. USE OF GELVET OVER CONVENTIONAL TIMs.srt (2.0 KB)
    • 2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.mp4 (14.7 MB)
    • 2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.srt (1.6 KB)
    6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY
    • 1. INTRODUCTION TO MMCs.mp4 (12.0 MB)
    • 1. INTRODUCTION TO MMCs.srt (2.3 KB)
    • 2. Al-DIAMOND MMC.mp4 (11.8 MB)
    • 2. Al-DIAMOND MMC.srt (1.6 KB)
    • 3. Al-SiC MMC.mp4 (11.1 MB)
    • 3. Al-SiC MMC.srt (1.8 KB)
    • 4. Al-Si MMC.mp4 (5.7 MB)
    • 4. Al-Si MMC.srt (0.9 KB)
    • 5. Cu-DIAMOND MMC.mp4 (9.7 MB)
    • 5. Cu-DIAMOND MMC.srt (1.5 KB)
    • 6. Al-GRAPHITE MMC.mp4 (9.2 MB)
    • 6. Al-GRAPHITE MMC.srt (1.0 KB)
    • 7. GOLD-GOLD INTERCONNECTION (GGI).mp4 (14.3 MB)
    • 7. GOLD-GOLD INTERCONNECTION (GGI).srt (1.3 KB)
    • 8. ROLE OF DIAMOND.mp4 (14.9 MB)
    • 8. ROLE OF DIAMOND.srt (1.8 KB)
    • 9. CARBON NANO TUBES (CNTs).mp4 (17.7 MB)
    • 9. CARBON NANO TUBES (CNTs).srt (2.0 KB)
    7. PHASE CHANGE MATERIALS
    • 1. MATERIALS USED IN PCM.mp4 (6.1 MB)
    • 1. MATERIALS USED IN PCM.srt (2.5 KB)
    8. ELECTROMAGNETIC SHIELDING (EMI)
    • 1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.mp4 (9.6 MB)
    • 1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.srt (0.8 KB)
    • 1.1 RESOURCE.pdf (3.9 MB)
    9. COURSE CLOSING SESSION
    • 1. CONCLUSION.mp4 (14.2 MB)
    • 1. CONCLUSION.srt (1.5 KB)
    • 2. CLOSING SESSION.mp4 (4.6 MB)
    • 2. CLOSING SESSION.srt (0.8 KB)
    • Bonus Resources.txt (0.3 KB)

Code:

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